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Suitable for LTCC\HTCC raw ceramic chip precision drilling, cavity

Application Industry:

Semiconductor ceramic package, power component, ceramic substrate

Suitable for alumina, aluminum nitride ceramic sheet precision drilling, marking

Application Industry:

Semiconductor ceramic package, power component, ceramic substrate

Strip cutting in casting process. It is necessary to cut through raw porcelain tape material, suitable for 6inch, 8inch bandwidth cutting material 0.4 or less HTCC, LTCC, HITCE and AIN casting tape material cutting effect neat edge, no c

Suitable for HTCC/LTCC raw tiles from roll to square

Application Industry:

Semiconductor ceramic package, power component, ceramic substrate

Suitable for HTCC/LTCC raw tiles to be automatically loaded into the steel frame, which is conducive to the automation of subsequent operations.

Application Industry:

Semiconductor ceramic package, power component, ceramic substrate

Ultrafast laser is used to reduce gold layer, nickel layer and gold-nickel layer in aluminum nitride ceramic substrate circuit

Application Industry:

Semiconductor ceramic package, power component, ceramic substrate