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Suitable for silicon, germanium, gallium nitride, gallium arsenide, indium phosphide, silicon nitride and so on. Numerical and alphabetic identification of wafers and two-dimensional code marking. It is also suitable for scribing and gro

The infrared picosecond laser is used to form a burst point inside silicon carbide and then the fragment, which is mainly suitable for silicon carbide wafer and sapphire invisible cutting. Also suitable for other parts of the wafer invis