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Wafer laser cutting machine
Product Introduction
Device functions:
The infrared picosecond laser is used to form a burst point inside silicon carbide and then the fragment, which is mainly suitable for silicon carbide wafer and sapphire invisible cutting. Also suitable for other parts of the wafer invis
Device functions:
The infrared picosecond laser is used to form a burst point inside silicon carbide and then the fragment, which is mainly suitable for silicon carbide wafer and sapphire invisible cutting. Also suitable for other parts of the wafer invisible cutting.

Application Industry:
Semiconductor, LED, photovoltaic, 3C and other industries